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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6830 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 1/3 HBC807 PNP EPITAXIAL PLANAR TRANSISTOR Description The HBC807 is designed for switching and AF amplifier amplification suitable for driver stages and low power output stages. Absolute Maximum Ratings SOT-23 * Maximum Temperatures Storage Temperature .......................................................................................... -55 to +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCES Collector to Base Voltage ........................................................................................ -50 V VCEO Collector to Emitter Voltage..................................................................................... -45 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current....................................................................................................... -800 mA Characteristics (Ta=25C) Symbol BVCEO BVCES BVEBO ICES IEBO *VCE(sat) VBE(on) *hFE fT Cob Min. -45 -50 -5 100 Typ. 100 Max. -100 -100 -700 -1.2 630 12 Unit V V V nA nA mV V MHz pF Test Conditions IC=-10mA IC=-100uA IE=-100uA VCE=-25V VEB=-4V IC=-500mA, IB=-50mA VCE=-1V, IC=-300mA VCE=-1V, IC=-100mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification Of hFE Rank hFE 9FA(16) 100-250 9FB(25) 160-400 9FC(40) 250-630 HBC807 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 Spec. No. : HE6830 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 2/3 Saturation Voltage & Collector Current 1000 VCE=1V Saturation Voltage (mV) hFE 100 100 VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current(mA) Collector Current (mA) On Voltage & Collector Current 10000 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) VCE=5V On Voltage (mV) 1000 VBE(on) @ VCE=1V 100 100 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10 Safe Operating Area PT=1ms Collector Current-IC (mA) 1 PT=100ms Capacitance (pF) Cob 10 0.1 PT=1s 0.01 1 0.1 1 10 100 0.001 1 10 100 Reverse Biased Voltage (V) Forward Voltage Vce (V) HBC807 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension A L Spec. No. : HE6830 Issued Date : 1994.01.25 Revised Date : 2002.10.24 Page No. : 3/3 Marking: 3 BS 1 V G 2 9F Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC807 HSMC Product Specification |
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